Notice: Trying to access array offset on value of type bool in /var/www/wp-content/themes/Divi/includes/builder/functions.php on line 2494
EMProbe | Y.I.C. Technologies ltd


Accurate and Repeatable High-Resolution EMC and EMI diagnostic with Hand held Near Field Probes on your lab-bench

Using Hand Held probes to identify and resolve EMC/EMI issue testing has never been this accurate and straightforward!

3D Precision Technology is used to assist high-density board designers to use off-the-shelf hand-held probes and visualize the root causes of potential EMC and EMI problems during pre and post-EMC compliance testing.

EMProbe enables the PCB and Design Engineers to diagnose EMC/EMI problems using regular off-the-shelf hand-held probes. An easy-to-use Robotic Arm controls the movement of the probe in any direction and an external Spectrum Analyzer provides the results. The EMViewer software is used to control the Robotic Arm and the external Spectrum Analyser collects and analyses the results.

Different types of Robotic Arms can be used, based on the desired size and resolution.

New Feature Release

Envelope scanning is a major new feature added to the EMViewer software using the EMProbe.

Envelope scanning enables the engineer to define the DUT’s 3D “envelope” by setting the probe height for each scanning point, enabling close scanning that allows the probe to go between individual components. The height definitions are saved to the project file after the first calibration, allowing quick and seamless repeatable scans.

This feature is only available when using the EMViewer with the EMProbe Robotic Arm.

Download the New Feature Release and How To document here


To view and/or download EMScanner resources, simply click on the links below:

Product Features


Spectral scan, spatial scan, peak-hold, continuous scanning, spectral and spatial comparison, scripting, limit lines, report generation, and notes.

Spatial scan time:

Continuous real-time for the entire scan area (1,218 probes activated) when Level 1 is selected:  5 sec.

Selected area 2.25 cm x 2.25 cm, 9 probes activated.

Level 1:  <0.5 sec. | Level 2: 4 sec. | Level 3: 9 sec. | Level 4: 21 sec. | Level 5: 55 sec. | Level 6: 2 min 35 sec. | Level 7: 7 min 23 sec. | Level 8: 24 min 00 sec.  

Spectral scan time:

11 seconds for L 10 cm x W 10 cm (L 4” x W 4”, 178 probes activated) from 10 MHz span to 110 MHz and 122 kHz RBW. Scanning area, span, and RBW are user selectable within spectrum analyzer specifications

Supported operating systems:

Windows 10®

Supported overlays:

Picture in JPEG format 

Standard Gerber© RS274x format and HPGL format CAD files


Broadband frequency coverage:
Base configuration = 150 kHz to 8 GHz

Antenna array:

1,218 (42 x 29) H-field probes.

Spatial resolution:

Level 1: 7.50 mm | Level 2: 3.75 mm | Level 3: 1.88 mm | Level 4: 0.94 mm

Level 5: 0.47 mm | level 6: 0.24 mm | Level 7:  0.12 mm | Level 8: 0.06 mm

Scan area:

L 31.6 cm x W 21.8 cm (L 12.44” x W 8.58”)

Frequency accuracy of peaks:

Peak marking accuracy of the spectrum analyzer

Probe to probe uniformity:

Calibrated before shipment. Firmware correction factors adjust for frequency dependant probe responses with +/- 3 dB accuracy

Measurement plane isolation:

> 20 dB

Maximum radiated power load:

10 W / 40 dBm


Anodized non-conductive metal

Maximum DUT voltage:

Glass Cover: 4kV DC; 2.6kV AC | Metal Case: 260V DC; 200V AC (measured as dielectric withstanding voltage – DWV)

Operating temperature:

From 15⁰ C to 40⁰ C

Fuse Rating:


Scanner connections:

PC: Ethernet

Dimensions of the scanner:

L 34.5 cm x W 43.5 cm x H 11 cm (L 13.58” x W 17.13” x H 4.33”)


12.70 Kg / 28 lb (including cables and the adaptor)



The instrument provides spatial and spectral scans that allow design teams to cut one to two design cycles out of their product development process. It also reduces their EMI testing time by up to two orders of magnitude.

The design team conducted the scans on the EMxpert system in their offices. In a matter of minutes, they obtained the results. Testing the design in a third-party chamber would have been weeks away.